● ʻO kā mākou mau lawelawe: Hoʻokahi PCB a me nā lawelawe hana uila PCBA
● ʻO ka lawelawe hana PCB: Pono ka faila Gerber (CAM350 RS274X), nā faila PCB (Protel 99, AD, Eagle), etc.
● Nā lawelawe ʻimi ʻana i nā ʻāpana: ʻO ka papa inoa BOM me ka helu ʻāpana kikoʻī a me ka mea hoʻolālā
● Nā lawelawe hui PCB: ʻO nā faila ma luna a me nā faila koho a kau, kiʻi kiʻi hui
● Nā lawelawe papahana a me ka hoʻāʻo ʻana: Polokalamu, instrouction a me ke ʻano hoʻāʻo etc.
● Nā lawelawe hui hale: nā faila 3D, ka wāwae a i ʻole nā mea ʻē aʻe
● Nā lawelawe ʻenekinia hoʻohuli: Nā laʻana a me nā mea ʻē aʻe
● Uea & uea hui hui: kiko'ī & 'ē aʻe
● Nā lawelawe ʻē aʻe: Nā lawelawe hoʻohui waiwai
ʻO ka mana ʻenehana PCB
| Nā ʻāpana | Hana nui: 2~58 papa / Pilot holo: 64 papa |
| Max.mānoanoa | Hana nui: 394mil (10mm) / Pilot holo: 17.5mm |
| Mea waiwai | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic filled, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partal hybrid, etc. |
| Min.Laulā/Spacing | Papa loko: 3mil/3mil (HOZ), Papa waho: 4mil/4mil(1OZ) |
| Max.Mānoanoa keleawe | UL palapala hōʻoia: 6.0 OZ / Pilot holo: 12OZ |
| Min.Ka nui o ka puka | Puka mīkini: 8mil(0.2mm) Puka Laser: 3mil(0.075mm) |
| Max.Nui o ka Panel | 1150mm × 560mm |
| ʻAspect Ratio | 18:1 |
| Hoʻopau ʻili | HASL, Gula Kaiapuni, Kino Kaiapuni, OSP, ENIG + OSP, Kālā Kaiapuni, ENEPIG, Manalima Gula |
| Kaʻina Kūikawā | Hole i kanu ʻia, puka makapō, kūʻē i hoʻopaʻa ʻia, hiki ke hoʻopili ʻia, Hybrid, ʻāpana ʻāpana, ʻāpana kiʻekiʻe kiʻekiʻe, wili hope, a me ka mana kū'ē. |
ʻO ka mana ʻenehana PCB
| SMT | Pono kūpono: 20 um |
| Nui o na mea:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max.ʻāpana kiʻekiʻe::25mm | |
| Max.Nui PCB:680×500mm | |
| Min.Ka nui PCB: ʻaʻohe palena | |
| PCB mānoanoa: 0.3 i 6mm | |
| PCB kaumaha:3KG | |
| Wave-Solder | Max.PCB laula:450mm |
| Min.PCB laula: ʻaʻohe palena | |
| Kiʻekiʻe o ka mea: 120mm/Bot 15mm | |
| Kahu-Solder | ʻAno metala: ʻāpana, holoʻokoʻa, inlay, sidestep |
| Mea metala: Copper , Aluminum | |
| Hoʻopau i ka ʻili: hoʻopaʻa ʻia Au, hoʻopaʻa ʻia i ka sliver, hoʻopaʻa ʻia Sn | |
| Ka helu ʻana o ka ea: emi iho ma mua o 20% | |
| Press-fit | Paʻi paʻi: 0-50KN |
| Max.Nui PCB: 800X600mm | |
| Ke hoao ana | ICT, Probe lele, puhi-i, ho'āʻo hana, kaʻa kaʻa wela |
