Papa PCBA Kamepiula a me na Lako Pilipili
Nā hiʻohiʻona huahana
● -Material: Fr-4
● -Helu Layer: 14 papa
● -PCB Mānoanoa: 1.6mm
● -Min.Helu / Space Ma waho: 4/4mil
● -Min.Puka wili ʻia: 0.25mm
● -Ma ke Kaʻina Hana: Tenting Vias
● -Papa Hoʻopau: ENIG
ʻO nā hiʻohiʻona PCB
1. Inika Solderresistant (Solderresistant/SolderMask): ʻAʻole pono nā ʻili keleawe a pau e ʻai i nā ʻāpana tin, no laila e paʻi ʻia ka wahi i ʻai ʻole ʻia me kahi papa o nā mea (epoxy resin maʻamau) e hoʻokaʻawale i ka ʻili keleawe mai ka ʻai ʻana i ka tin a pale aku i ka hoʻolele ʻole.Aia kahi kaapuni pōkole ma waena o nā laina tinned.Ma muli o nā kaʻina hana likeʻole, ua māheleʻia i kaʻaila'ōmaʻomaʻo, kaʻailaʻulaʻula a me kaʻaila polū.
2. Papa Dielectric (Dielectric): Hoʻohana ʻia ia e mālama i ka insulation ma waena o nā laina a me nā papa, i ʻike ʻia ʻo ka substrate.
3. Ka mālama ʻana i ka ʻili (SurtaceFinish): No ka mea ua maʻalahi ka oxidized o ka ʻili keleawe i ke kaiapuni maʻamau, ʻaʻole hiki ke hoʻopaʻa ʻia (ʻino ʻole ka solderability), no laila e pale ʻia ka ʻili keleawe e hoʻopaʻa ʻia.ʻO nā ʻano pale e pili ana i ka HASL, ENIG, Immersion Silver, Immersion TIn, a me ka mea mālama solder organik (OSP).Loaʻa i kēlā me kēia ala kona mau pono ponoʻī a me nā hemahema, i kapa ʻia ʻo ka mālama ʻana i luna.
ʻO ka mana ʻenehana PCB
| Nā ʻāpana | Hana nui: 2~58 papa / Pilot holo: 64 papa |
| Max.mānoanoa | Hana nui: 394mil (10mm) / Pilot holo: 17.5mm |
| Mea waiwai | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic filled, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partal hybrid, etc. |
| Min.Laulā/Spacing | Papa loko: 3mil/3mil (HOZ), Papa waho: 4mil/4mil(1OZ) |
| Max.Mānoanoa keleawe | UL palapala hōʻoia: 6.0 OZ / Pilot holo: 12OZ |
| Min.Ka nui o ka puka | Puka mīkini: 8mil(0.2mm) Puka Laser: 3mil(0.075mm) |
| Max.Nui o ka Panel | 1150mm × 560mm |
| ʻAspect Ratio | 18:1 |
| Hoʻopau ʻili | HASL, Gula Kaiapuni, Kino Kaiapuni, OSP, ENIG + OSP, Kālā Kaiapuni, ENEPIG, Manalima Gula |
| Kaʻina Kūikawā | Hole i kanu ʻia, puka makapō, kūʻē i hoʻopaʻa ʻia, hiki ke hoʻopili ʻia, Hybrid, ʻāpana ʻāpana, ʻāpana kiʻekiʻe kiʻekiʻe, wili hope, a me ka mana kū'ē. |
Hoʻolālā ʻia kā mākou mau papa PCBA e hoʻokō i kēia mau koi e ulu nei ma o ka hāʻawi ʻana i nā hoʻonā hana kiʻekiʻe e hoʻohui i ka wikiwiki, ka hana, a me ka mālama ʻana i ka ʻike.Inā ʻoe he mea hoʻolako kikowaena cloud computing, he mea loiloi ʻikepili nui a i ʻole kahi kahua pāʻoihana kaiapili, kūpono kā mākou papa PCBA iā ʻoe.
Hana ʻia ka papa PCBA i nā mea Fr-4 kiʻekiʻe e hōʻoia i ka paʻa a me ka hilinaʻi.Loaʻa iā ia he 14 mau papa, e hāʻawi ana i kahi ākea no nā ʻāpana a hiki i ka hoʻohui ʻana i nā kaapuni holomua.Me ka mānoanoa o 1.6mm, ua loaʻa iā ia kahi kaulike kūpono ma waena o ka compactness a me ka hana.
Hoʻomaopopo mākou i ke koʻikoʻi o ka pololei helu helu, ʻo ia ke kumu e hoʻolālā ai mākou i nā papa PCBA me ka liʻiliʻi o ka trace/space waho o 4/4mil.Mālama kēia i ka hoʻouna ʻana i ka hōʻailona maʻemaʻe a hoʻemi i ka pilikia o ke keakea.ma ka palena haahaa.ʻO ka 0.25mm drilling size e hōʻoiaʻiʻo i ka hoʻopili ʻana i ka noi ākea, kūpono ia no nā hiʻohiʻona helu helu like ʻole.
No ka hoʻokō pono ʻana i ka hana a pale i ka papa, hoʻohana mākou i kahi hale lole ma o ke kaʻina hana e pale ai i ka makū a i ʻole nā mea haumia mai ke komo ʻana i ka PCB.Mālama kēia i ka hilinaʻi nui a me ke ola lōʻihi no kāu ʻōnaehana kamepiula.
No ka hoʻolako ʻana i ka pilina maikaʻi a me ka pale ʻana i ka corrosion, loaʻa i kā mākou papa PCBA kahi hoʻopau ENIG i loaʻa i kahi ʻāpana gula ma luna o ka nickel.Hiki i kēia ke hoʻohui ikaika a hoʻonui i ka hana holoʻokoʻa o ka papa.
ʻO kā mākou kamepiula a me nā papa PCBA peripheral ka hopena hope loa no kāu pono kamepiula.Me kāna mau hiʻohiʻona kiʻekiʻe a me ka maikaʻi premium, hōʻoiaʻiʻo ia i ka hana hilinaʻi a me ka wikiwiki o ka hoʻololi ʻike.E noho ma mua o ka hoʻololi kikohoʻe me kā mākou papa PCBA kūlana kiʻekiʻe.
