Kaʻa uila PCBA papa
Nā hiʻohiʻona huahana
● -Ka ho'āʻo hilinaʻi
● -Ka hiki ke huli
● -Hooponopono wela
● -Ke keleawe kaumaha ≥ 105um
● -HDI
● -Semi - lohi
● -Oolea - lohi
● -High frequency milimeter microwave
ʻO nā hiʻohiʻona PCB
1. Papa Dielectric (Dielectric): Hoʻohana ʻia ia e mālama i ka insulation ma waena o nā laina a me nā papa, i ʻike nui ʻia ʻo ka substrate.
2. Silkscreen (Legend/Marking/Silkscreen): He mea pono ole keia. ʻO kāna hana nui ka hōʻailona i ka inoa a me ka pahu kūlana o kēlā me kēia ʻāpana ma ka papa kaapuni, kahi kūpono no ka mālama ʻana a me ka ʻike ma hope o ka hui ʻana.
3.Surface lapaʻau (SurtaceFinish): No ka mea, ua maʻalahi ka ili keleawe i oxidized i loko o ke kaiapuni maʻamau, ʻaʻole hiki ke tinned (poor solderability), no laila, e hoomaluia ka ili keleawe e tinned. ʻO nā ʻano pale e pili ana i ka HASL, ENIG, Immersion Silver, Immersion TIn, a me ka mea mālama solder organik (OSP). Loaʻa i kēlā me kēia ala kona mau pono ponoʻī a me nā hemahema, i kapa ʻia ʻo ka mālama ʻana i luna.
ʻO ka mana ʻenehana PCB
| Nā ʻāpana | Hana nui: 2~58 papa / Pilot holo: 64 papa |
| Max. mānoanoa | Hana nui: 394mil (10mm) / Pilot holo: 17.5mm |
| Mea waiwai | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic filled, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partal hybrid, etc. |
| Min. Laulā/Spacing | Papa loko: 3mil/3mil (HOZ), Papa waho: 4mil/4mil(1OZ) |
| Max. Mānoanoa keleawe | UL palapala hōʻoia: 6.0 OZ / Pilot holo: 12OZ |
| Min. Ka nui o ka puka | Puka mīkini: 8mil(0.2mm) Puka Laser: 3mil(0.075mm) |
| Max. Nui o ka Panel | 1150mm × 560mm |
| ʻAspect Ratio | 18:1 |
| Hoʻopau ʻili | HASL, Gula Kaiapuni, Kino Kaiapuni, OSP, ENIG + OSP, Kālā Kaiapuni, ENEPIG, Manalima Gula |
| Kaʻina Kūikawā | Hole i kanu ʻia, puka makapō, kūʻē i hoʻopaʻa ʻia, hiki ke hoʻopili ʻia, huila, ʻāpana ʻāpana, ʻāpana kiʻekiʻe kiʻekiʻe, wili hope, a me ka mana kū'ē. |
