ʻO ka mea hana papa PCBA palekana uila

ʻO kā mākou lawelawe:

Hiki ke hoʻohui a hoʻopili pū ʻia ka antenna a me ka hana hōʻailona.

ʻO ka hoʻolālā paʻa e hōʻoia i kahi ala hōʻailona pōkole.

Haʻahaʻa haʻahaʻa i ka hoʻouna ʻana a me ka hana ʻana.


Huahana Huahana

Huahana Huahana

Nā hiʻohiʻona huahana

● Material: Fr-4

● Ka helu papa: 6 papa

● PCB mānoanoa: 1.2mm

● Min.Helu / Wahi waho: 0.102mm/0.1mm

● Min.Puka wili ʻia: 0.1mm

● Ma ke Kaʻina Hana: Tenting Vias

● Ili Pau: ENIG

Pōmaikaʻi

1) Nā makahiki o ka ʻike ma ka hana ʻana i ka hapalua, me ka hoʻohana ʻana i ka mīkini ʻo Da Chuan Routing, e hoʻokele i ka hapalua a laila e hoʻokele i ke ʻano, e hoʻokō i nā koi koʻikoʻi;

2) ʻO ka laulā laina liʻiliʻi a me ka spacing laina: 0.065 / 0.065mm, ka liʻiliʻi BGA pad: 0.2mm, e hālāwai me nā pono kūikawā o ka mea kūʻai;

3) Electroplated Copper Flling of Blind Holes by Universal DVCP (Double Track Vertical Continuous Copper Plating Equipment) no ka hōʻoia ʻana ʻaʻohe puka i loko o nā lua a me ka maikaʻi o nā huahana mea kūʻai aku;

4) ʻO ke ʻano hoʻohālikelike koʻikoʻi, e hōʻoiaʻiʻo i ka hua o nā mea kūʻai aku.

acsavav (1)
acsavav (2)

ʻO ka mana ʻenehana PCBA

SMT Pono kūpono: 20 um
Nui o na mea:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max.ʻāpana kiʻekiʻe::25mm
Max.Nui PCB:680×500mm
Min.Ka nui PCB: ʻaʻohe palena
PCB mānoanoa: 0.3 i 6mm
PCB kaumaha:3KG
Wave-Solder Max.PCB laula:450mm
Min.PCB laula: ʻaʻohe palena
Kiʻekiʻe o ka mea: 120mm/Bot 15mm
Kahu-Solder ʻAno metala: ʻāpana, holoʻokoʻa, inlay, sidestep
Mea metala: Copper , Aluminum
Hoʻopau i ka ʻili: hoʻopaʻa ʻia Au, hoʻopaʻa ʻia i ka sliver, hoʻopaʻa ʻia Sn
Ka helu ʻana o ka ea: emi iho ma mua o 20%
Press-fit Paʻi paʻi: 0-50KN
Max.Nui PCB: 800X600mm
Ke hoao ana ICT, Probe lele, puhi-i, ho'āʻo hana, kaʻa kaʻa wela

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