ʻO ka mea hana papa PCBA palekana uila
Nā hiʻohiʻona huahana
● Material: Fr-4
● Ka helu papa: 6 papa
● PCB mānoanoa: 1.2mm
● Min.Helu / Wahi waho: 0.102mm/0.1mm
● Min.Puka wili ʻia: 0.1mm
● Ma ke Kaʻina Hana: Tenting Vias
● Ili Pau: ENIG
Pōmaikaʻi
1) Nā makahiki o ka ʻike ma ka hana ʻana i ka hapalua, me ka hoʻohana ʻana i ka mīkini ʻo Da Chuan Routing, e hoʻokele i ka hapalua a laila e hoʻokele i ke ʻano, e hoʻokō i nā koi koʻikoʻi;
2) ʻO ka laulā laina liʻiliʻi a me ka spacing laina: 0.065 / 0.065mm, ka liʻiliʻi BGA pad: 0.2mm, e hālāwai me nā pono kūikawā o ka mea kūʻai;
3) Electroplated Copper Flling of Blind Holes by Universal DVCP (Double Track Vertical Continuous Copper Plating Equipment) no ka hōʻoia ʻana ʻaʻohe puka i loko o nā lua a me ka maikaʻi o nā huahana mea kūʻai aku;
4) ʻO ke ʻano hoʻohālikelike koʻikoʻi, e hōʻoiaʻiʻo i ka hua o nā mea kūʻai aku.
ʻO ka mana ʻenehana PCBA
SMT | Pono kūpono: 20 um |
Nui o na mea:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max.ʻāpana kiʻekiʻe::25mm | |
Max.Nui PCB:680×500mm | |
Min.Ka nui PCB: ʻaʻohe palena | |
PCB mānoanoa: 0.3 i 6mm | |
PCB kaumaha:3KG | |
Wave-Solder | Max.PCB laula:450mm |
Min.PCB laula: ʻaʻohe palena | |
Kiʻekiʻe o ka mea: 120mm/Bot 15mm | |
Kahu-Solder | ʻAno metala: ʻāpana, holoʻokoʻa, inlay, sidestep |
Mea metala: Copper , Aluminum | |
Hoʻopau i ka ʻili: hoʻopaʻa ʻia Au, hoʻopaʻa ʻia i ka sliver, hoʻopaʻa ʻia Sn | |
Ka helu ʻana o ka ea: emi iho ma mua o 20% | |
Press-fit | Paʻi paʻi: 0-50KN |
Max.Nui PCB: 800X600mm | |
Ke hoao ana | ICT, Probe lele, puhi-i, ho'āʻo hana, kaʻa kaʻa wela |