Hoʻolauna Hui
Aia ʻo Shenzhen UC Industrial Limited ma Shenzhen a hoʻokumu ʻia ma 2012. Ma ke ʻano he hoʻokahi o ka PCB uila paʻa a me ka mea hana PCBA ma Kina, ua ʻoi aku mākou ma mua o 11 mau makahiki ʻike i ka hoʻolako ʻana i ka lawelawe uila uila hoʻokahi, ʻo ia hoʻi ka PCB manufacturing, component sourcing, SMT a me ka hui ʻana ma loko o ka lua, ka polokalamu IC, AOI, ka nānā ʻana i ka X-ray, ka hoʻāʻo hana a me ka hale pahu paʻa etc.
Hoʻokumu ʻia
Wahi kanu
ʻEnekinia
Ka makou hana
Hāʻawi pū mākou i nā ʻano papa kaapuni paʻi like ʻole, e like me PCB ʻoʻoleʻa, PCB hikiwawe, PCB rigid-flex, PCB keleawe mānoanoa a me ka PCB high density interconnect (HDI) PCB. Pono nā PCB āpau e hele i ka ICT, Automated Optical Inspection (AOI), X-ray, hoʻāʻo hana a me ka hoʻāʻo ʻelemakule ma mua o ka hoʻouna ʻana e kā mākou hale hana. Hoʻokipa ʻia kāu OEM, ODM a me nā kauoha hui. Hoʻonohonoho pū mākou i kahi lawelawe IC Rework a me IC soldering kūikawā a paʻakikī loa, e like me ka BGA chip rework a me ka soldering a me ka BGA re-balling.
Hoa a me na Makeke
Hāʻawi pū mākou i nā ʻano papa kaapuni paʻi like ʻole, e like me PCB ʻoʻoleʻa, PCB hikiwawe, PCB rigid-flex, PCB keleawe mānoanoa a me ka PCB high density interconnect (HDI) PCB. Pono nā PCB āpau e hele i ka ICT, Automated Optical Inspection (AOI), X-ray, hoʻāʻo hana a me ka hoʻāʻo ʻelemakule ma mua o ka hoʻouna ʻana e kā mākou hale hana. Hoʻokipa ʻia kāu OEM, ODM a me nā kauoha hui. Hoʻonohonoho pū mākou i kahi lawelawe IC Rework a me IC soldering kūikawā a paʻakikī loa, e like me ka BGA chip rework a me ka soldering a me ka BGA re-balling.
ʻO ka wikiwiki a me ka wikiwiki
Me kā mākou manawa alakaʻi wikiwiki a wikiwiki, noho wikiwiki kā mākou mea kūʻai i ka mākeke me kā lākou wikiwiki noiʻi wikiwiki.
Palapala noi
Hoʻohana nui ʻia kā mākou huahana i ka Communication, ka paʻi 3D a me ka ʻoihana IOT etc.
Hui
Loaʻa iā mākou kahi hui ʻenekinia ʻike i loaʻa mau e kūkākūkā i kāu mau koi.
